Description
High‑activity flux paste effectively removes oxide layers on solder joints and improves solder wetting for reliable soldering.
UV trace formula: residue glows under UV light for easy inspection after repair work.
Low‑residue, low‑corrosion formulation, safe for PCB boards and chips, suitable for precision BGA, IC, and phone motherboard repair.
10ML syringe packaging, easy‑to‑control dispensing, convenient for manual operation.
Good flow performance, prevents cold solder and bridging, widely used for electronics rework and soldering projects.
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