Description
High?activity soldering flux removes surface oxidation, enhancing solder wetting for stable joint formation.
UV?traceable residue glows under a UV lamp to check flux coverage after repair.
Low?corrosion formula, no damage to PCBs and chips, fits precise BGA, IC, and mobile mainboard rework.
10?ML syringe package, easy dispensing for manual repair operations.
Good viscosity reduces cold solder joints and solder bridging, widely used for electronics soldering work.
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