Description
High Thermal Conductivity: Delivers 128 W/m??K thermal conductivity, enabling efficient heat transfer from CPU/GPU to the heatsink for optimal cooling performance.
Stable Heat Dissipation: The liquid metal formulation maintains consistent thermal conductivity under high temperatures, preventing thermal throttling during intensive workloads or gaming.
Wide Compatibility: Suitable for CPUs, GPUs, and other high-heat electronic components, making it ideal for PC builds, gaming consoles, and overclocking setups.
Long-Lasting Performance: The 10 g package provides enough material for multiple applications, and the non-drying formula ensures reliable heat dissipation over time.
Easy Application: The paste-like consistency allows precise and even spreading on heat-generating surfaces, ensuring full contact with the heatsink.









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