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BGA reball heated stencil:
SCEI (Sony Computer Entertainment, Inc.) CXD90026G SoC 0.55mm solder
SCEI CXD90025G Secondary/Low Power Processor for Network Tasks 0.40mm solder
Samsung K4B2G1646E-BCK0/2Gb DDR3 SDRAM 0.40mm solder
Samsung K4G41325FC-HC03/ 4 Gb (512 MB) GDDR5 RAM 0.40mm solder
Item:
1* PS4 GPU CXD90026G CXD90025G DDR3 DDR5 BGA Direct Heat Stencil Template Kit (4 Piece Kit)
| Weight | 0.01 kg |
|---|---|
| Dimensions | 4.6 × 4.6 × 0.4 cm |
| Condition | OEM |
| Logo | Neutral |
| Battery | No |
| Origin | Made in China |
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