Description
Adopts an intelligent temperature control algorithm, with heating curves factory-calibrated to prevent heat diffusion from damaging the motherboard and surrounding small components, while also eliminating the risk of components being blown away by excessive airflow from conventional hot air guns.
The hidden telescopic screw and fully enclosed screw structure design effectively prevent debris from entering the internal mechanism, reducing jamming and dirt accumulation, thereby extending service life.
The debonding process applies zero mechanical pressure to the chip, reducing the risk of scratching the chip or damaging the pads during the debonding operation.
Weight
0.12 kg
Dimensions
11.0 ?? 9.0 ?? 3.0 cm
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