Description
High Thermal Conductivity??16.8W/m??K thermal putty for fast heat dissipation from GPUs, CPUs, and ICs.
Ideal Thermal Pad Replacement?? Malleable putty fills gaps for full contact, outperforming rigid thermal pads.
No Mess, Easy to Use?? Soft, non-curing, reusable putty with zero curing time or residue.
Long-Lasting Performance?? No drying or hardening, maintains stable cooling over time.
Wide Compatibility?? Perfect for gaming consoles, PCs, graphics cards, and more.









Reviews
There are no reviews yet.