Description
Efficiently transfers heat generated by core chips such as CPUs and GPUs to metal heat sinks or the device enclosure, effectively preventing performance degradation caused by overheating.
Silicone material exhibits excellent compressibility, perfectly conforming to the irregular surface structure of chips and completely expelling air – whose thermal conductivity is poor – to minimize interfacial thermal resistance.
The thermal pad has a slightly tacky surface, allowing it to adhere easily to chips. During precision repairs under a microscope, this property prevents the pad from sliding or falling off, significantly reducing operational difficulty.
Weight
0.07 kg
Dimensions
5.0 ?? 5.0 ?? 5.0 cm
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