Description
The repaired area perfectly restores the original pad’s shape, with almost no visible repair traces – achieving truly “traceless repair.”
Its ultra-thin profile – only 0.1 ?? 0.3 mm – allows it to seamlessly integrate with the user’s motherboard, without affecting the thickness or structural design of any surrounding components.
Made of high-quality phosphor bronze material, it features low resistance, high electrical conductivity, high strength, and fatigue resistance, ensuring stability and durability after welding.
The extremely high flatness effectively prevents false soldering caused by uneven solder joints, ensuring long-term reliability of electrical connections.
Weight
0.05 kg
Dimensions
10.0 ?? 6.0 ?? 2.0 cm
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