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New 2012 Hot selling Bga Multi-functional Reballing Stencils (90*90)

SKU: EOT0083

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Description

The liberation of your hands to the lock mechanism, improve the work efficiency; industry first, to fill the gaps in the industry;

Handle under the pressure of bodies bumping stencil and – smooth separation of the solder ball does not shift, bumping yield;

Screw driven support slider mobile synchronization (at the same time the relocation or move) to facilitate the positioning of the different sizes of IC;

Four support the four corners of the slider can – boosting the stable manner than the diagonal positioning, improve the yield of the plant the ball;

Support the size of the locating slot on the slider, and the other on the small size, the smaller the – can be used to plant the ball, larger – can locate the four corners, good stability, planting the ball good high ;

Base has four height adjustment screws can be adjusted according to the different thickness of the – support slider positioning surface and cover the distance from the plant ball steel gateway in different thickness – bumping;

Superstructure with a solder balls poured trough the structure convenience of the superstructure excess solder balls poured out;

Superstructure inside a tin ball storage room, the structure is poured into excess solder balls not always have to pour out, but stored in the structure, improve production efficiency;

Generous design, reasonable structure design
Item:

1* New 2012 Hot selling Bga Multi-functional Reballing Stencils (90*90)

Additional information

Weight 0.68 kg
Dimensions 12.5 × 11 × 7.5 cm
Condition

1
1

Origin

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